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CHUAN AUTOMATION & ENGINEERING SDN BHD (468293M)
CHUAN MULTINATION PRODUCTS ENTERPRISE (1225367A)
No. 11-2 (1st floor), Jalan SP 2/9, Serdang Perdana, Seri Kembangan, 43300 Selangor, Malaysia.
(Hunting Line)
+6012-277 8268
Semiconductor
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Substrate
IC chips are rapidly evolving. In order to maximize their performance, SHINKO provides substrates that have a variety of features for semiconductor packages.
Product Line-up
Leadframe
Widely used leadframe packages. SHINKO is manufacturing various types of leadframes by using ultra-precision stamping or chemical etching.
Product Line-up
IC Assembly
IC assembly for mounting IC chips in package, SHINKO is developing various interconnect technologies for supporting semiconductor packages from single-chip packaging to module assembly.
Product Line-up
Glass-to-Metal Seals (GTMS)
Glass-to-Metal Seals made of metal and glass. SHINKO’s Glass-to-Metal Seals products are characterized by high hermeticity and superior electrical characteristics, and are widely used in products requiring high reliability, such as semiconductor laser and automotive device, etc.